文章摘要
球形金粉的化学还原制备及表征
A Spherical Gold Powder Prepared by Chemical Reduction and Its Characterization
投稿时间:2018-08-31  
DOI:
中文关键词: 金属材料  金粉  金浆料  厚膜导体  丝网印刷
英文关键词: metal materials  gold powder  gold paste  thick film conductor  screen printing
基金项目:
作者单位E-mail
关俊卿 有研亿金新材料有限公司北京 102200 gjq@grikin.com 
滕海涛 有研亿金新材料有限公司北京 102200  
陈峤 有研亿金新材料有限公司北京 102200  
王鹏 有研亿金新材料有限公司北京 102200  
李治宇 有研亿金新材料有限公司北京 102200  
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中文摘要:
      以抗坏血酸(VC)为还原剂,以聚乙烯醇为分散剂还原氯金酸制备金粉,制备得到粒径为1~3 μm的高致密球形金粉末。用SEM对所制金粉进行了表征,分析分散剂的不同用量对金粉形貌和粒径的影响,还原剂滴加速度对金粉形貌和粒径的影响。将所制金粉配制成金浆料,丝网印刷高温烧结后,表征金膜特性。结果表明该金粉可用于制备厚膜金导体浆料。
英文摘要:
      Gold powder was prepared by reduction of chloro auric acid with ascorbic acid (VC) as reducing agent and polyvinyl alcohol as dispersant, high density gold powder with a diameter of 1-3 microns. The prepared gold powders were characterized by SEM, the influence of different dosage of dispersant on the morphology and particle size of gold powder was analyzed, effect of reducing agent adding speed on the morphology and particle size of gold powders. The gold powder is made into gold slurry, characterization of gold film characteristics after screen printing high temperature sintering. The results showed that the gold powder can be used for preparing thick film gold conductor paste.
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